|DATE:||June 15, 1998|
|RE:||Progress report on quartz etch rate project.|
Purpose. The purpose of the project is to obtain quartz etch rate data for future reference. Instructions will be provided that will insure accurate results when followed.
There are three main phases for this project:
The first objective is completed. The second objective is 75% complete. All etch rate tests will be done by the end ofthe month. I have begun to enter data from the etch tests into the computer for automatic statistical process analysis. There is also a completed outline of the report which has beenenclosed. Most of the time has been spent on the first phase of the project.
Objective 1: Material and Information Acquisition
Work Completed. Immediately upon your approval of the project, I ordered the quartz chips for the etch tests from Heraus. As you know, there was some difficulty getting the purchase order approved due to recent cut backs in spending at AMD. It was necessary to get approval for the purchase of these chips from the fabrication director, Raphael Lunga. This delayed the process by 3 weeks. Your assistance in obtaining approval was invaluable. Heraus was approximately 3 weeks late shipping the quartz etch test disks. There was a problem with the quartz polishing tool and they were backlogged with orders. During the time I was waiting for approval for purchase and delivery of the quartz disks, I was able to do extensive research on quartz cleaning. The additional time was used to create various etching recipes on the Polyflow, discuss surface roughness testing with the development center, and locate and train on engineering test software that has enabled me to perform this test more efficiently.
Objective 2: Performing Etch Rate Tests
Work Completed. Execution of the etch rate tests has been flawless. A method for measuring the disks for thickness and surface roughness was adopted. This method allows for some disks to be in all phases of the testing process at once (pre-measurement for thickness, pre-measurement for surface roughness, etching, post measurement for thickness and post measurement for surface roughness.) Detailed instructions were created which allows anyone to repeate procedure. Several operators were asked to perform and etch test using only the written instructions and no further information. They were able to repeat the test without error.
Work Remaining. 31 of the 39 necessary etches have been performed. The remaining 8 tests will be completed by the end of the month. Objective 3: Analysis of Data and Report
Work Completed. All data from completed etch tests have been entered into the computer for automatic analysis. An outline for the report has been completed.
Work Remaining. Write, and submit for approval, project report. Add etch rate procedure to the Polyflow operation specification. According to the revised schedule the report will be submitted on August 5, 1998.
With the exception of the time delays at the beginning of the project, there have been no problems. If you wish to see any of the actual data from the testing, let me know. If you have any suggestions or concerns, please let me know so that I may address them before I write the report.
Manufacturing Technician, Diffusion
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